This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 1987.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1987
Title: David L Fletcher: Innovator in Electrophoretic Insulation Technology
Introduction
David L Fletcher is a notable inventor based in Georgetown, KY (US). He has made significant contributions to the field of printed circuit technology, particularly through his innovative patent.
Latest Patents
David L Fletcher holds a patent for "Electrophoretic insulation of metal circuit board core." This invention involves a printed circuit that incorporates an internal metal sheet designed for heat dissipation. The design features a roughened aluminum sheet with via holes that are coated with acrylic or epoxy resin containing thixotropic fumed silicon dioxide or silicate clay. The resin and thixotropic agent are electrophoretically coated, allowing the thixotropic agent to serve a dual purpose: it helps to even the coating around edges and acts as a bonding material for metal plating on the printed circuit.
Career Highlights
David L Fletcher is currently employed at International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to explore and develop advanced technologies in the realm of circuit board design and manufacturing.
Collaborations
One of his notable coworkers is Arthur E Graham, with whom he has likely collaborated on various projects within the company.
Conclusion
David L Fletcher's innovative work in electrophoretic insulation technology showcases his expertise and commitment to advancing printed circuit technology. His contributions continue to influence the industry and highlight the importance of innovation in engineering.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile