Torrance, CA, United States of America

David K Uyemura


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 173(Granted Patents)


Company Filing History:


Years Active: 1996

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1 patent (USPTO):Explore Patents

Title: David K Uyemura: Innovator in Integrated Circuit Technology

Introduction

David K Uyemura is a notable inventor based in Torrance, California. He is recognized for his contributions to the field of integrated circuit technology. His innovative work has led to the development of a unique patent that enhances the efficiency and functionality of electronic devices.

Latest Patents

David K Uyemura holds a patent for a groundbreaking invention titled "Three-dimensional integrated circuit stacking." This patent involves a plurality of integrated circuit chips that are packaged in a stack, where individual chip layers are interconnected and sealed to form a hermetically sealed package. The design includes input/output pads on the upper and lower layers, ensuring effective communication between the chips. Each chip layer features a chip carrier substrate with a chip cavity and electrically conductive vias, which are crucial for the interconnection of the layers. The innovative sealing method employed in this patent allows for a completely sealed package, enhancing the reliability of the integrated circuits.

Career Highlights

David K Uyemura has made significant strides in his career, particularly through his work at Hughes Electronics Corporation. His expertise in integrated circuit technology has positioned him as a key player in the advancement of electronic components. His patent reflects his commitment to innovation and the improvement of electronic device performance.

Collaborations

Throughout his career, David has collaborated with esteemed colleagues such as Warren Hayden and Richard E Burney. These partnerships have contributed to the successful development of his patented technologies and have fostered a collaborative environment for innovation.

Conclusion

David K Uyemura's contributions to integrated circuit technology exemplify the spirit of innovation in the electronics industry. His patent for three-dimensional integrated circuit stacking showcases his ability to enhance electronic device functionality. His work continues to influence the field and inspire future advancements in technology.

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