David J Specht

Title: **Innovative Contributions of David J Specht**

Introduction

David J Specht, a distinguished inventor based in Duxbury, Vermont, has made significant strides in the field of semiconductor technology with his innovative patents. With a focus on improving the deposition processes of solder bumps, Specht's inventions have garnered attention in industry circles.

Latest Patents

Specht holds two notable patents, including his latest invention titled "Wafer Integrated Rigid Support Ring." This innovative shadow mask for depositing solder bumps features additional dummy holes placed adjacent to the holes corresponding to most of the perimeter chips of the wafer. These extra dummy holes enhance the uniformity of plasma etching on the contact points of the wafer, subsequently improving the etching of contacts for perimeter chips and reducing contact resistance. Furthermore, the design allows for solder bumps outside the perimeter chips, which can support a second shadow mask for the deposition of additional materials, such as tin, onto reflowed solder bumps for efficient chip mounting on plastic substrates at low temperatures. Additionally, Specht's improved mask to wafer alignment aid, created from standard solder bumps, effectively prevents damage to test probes while promoting better course alignment.

Career Highlights

David J Specht is currently associated with the International Business Machines Corporation (IBM), where he applies his expertise in semiconductor technology. His contributions are crucial in advancing the company’s capabilities in innovative technology solutions, particularly in the realm of wafer processing.

Collaborations

Throughout his career, Specht has collaborated with fellow inventors and professionals, including Harry David Cox and David P Daniel. These collaborations have not only fostered a shared innovative environment but have also led to the development of patents that contribute to the advancement of technology.

Conclusion

David J Specht's inventive spirit and technical expertise have positioned him as a key player in the field of semiconductor technology. His innovative approaches to improving the solder bump deposition process underscore his commitment to advancing industry standards, making significant contributions to his company and the field at large.