Sheffield Lake, OH, United States of America

David J Smith


Average Co-Inventor Count = 3.5

ph-index = 4

Forward Citations = 66(Granted Patents)


Company Filing History:


Years Active: 1991-1993

Loading Chart...
4 patents (USPTO):Explore Patents

Title: David J Smith: Innovator in Polycycloolefin Resin Technologies

Introduction

David J Smith, an accomplished inventor based in Sheffield Lake, OH, has made significant contributions to the field of materials science. With a total of four patents to his name, Smith's innovations primarily revolve around curable polycycloolefin resin solutions, showcasing his expertise in the fabrication of printed circuit boards.

Latest Patents

Among Smith's latest patents, his work on curable polycycloolefin resin solutions stands out. These solutions have particular utility in making printed circuit boards by utilizing solvent-soluble polymers solution polymerized from norbornene-type monomers. His patents describe a process where a metathesis catalyst package is used for polymerization, followed by purification through precipitation and redissolution. The addition of a curing agent, such as a high activation temperature peroxide, allows for the impregnation of suitable substrates, including fiberglass cloth. The resulting printed circuit boards exhibit notable resistance to organic solvents and molten solder while maintaining excellent electrical properties.

Career Highlights

David J Smith has worked for prominent companies, including The B.F. Goodrich Company and The B.F. Goodrich Corporation. His tenure in these organizations has allowed him to refine his innovative techniques and broaden his scope within the polymer industry.

Collaborations

Throughout his career, Smith has had the privilege of collaborating with esteemed coworkers such as George M Benedikt and Linwood P Tenney. Their joint efforts have undoubtedly facilitated advancements in the development of prepregs and wiring boards made from copolymers derived from cycloolefin monomers, enhancing adhesion and dielectric properties.

Conclusion

David J Smith's contributions to the field of printed circuit board fabrication through his innovations in polycycloolefin resin solutions have established him as a noteworthy inventor. His ongoing dedication to exploration and experimentation continues to push the boundaries of technology, cementing his status in the realm of material science innovation.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…