The B. F. Goodrich Company

The B.f. Goodrich Corporation

David J Smith

George M Benedikt

Linwood P Tenney

Robert J Minchak

Timothy J Kettering

Dennis A Barnes

Dennis J Janda

Lindwood P Tenney

Curable polycycloolefin resin solutions having particular utility in the fabrication of printed circuit boards are disclosed. A solvent soluble polymer is typically solution polymerized from norbornene-type monomers in the presence of a metathesis catalyst package. This polymer may then be purified by precipitation and redissolution. A curing agent, such as a high activation temperature peroxide can then be added to the solution and then this curing agent containing solution can be used to impregnate a suitable substrate such as a fiberglass cloth. The impregnated substrate can then be dried, preferably at temperatures above the glass transition temperature of the polycycloolefin but below the activation temperature of the curing agent. Then one or more prepregs can be stacked and laminated to conductive foil at a temperature high enough to activate the curing agent. Printed circuit boards are obtained which have good resistance to organic solvents such as methylene chloride and to molten solder and which also display good electrical properties such as dielectric constant less than about 3.5 at 1 MHz and a dissipation constant less than about 0.005 at 1 MHz.

Curable polycycloolefin resin solutions, their use in making printed

Copolymers for use in preparing prepregs, which in turn are used to prepare printed circuit wiring boards are provided, as well as processes for producing the prepregs and wiring boards. The copolymers comprise repeating units derived from cycloolefin monomers, e.g., norbornene-type monomers, e.g., dicyclopentadiene-type monomers. Some of the monomers are silane-substituted while others are non silane-substituted. The silane-substituted monomers provide copolymers which exhibit improved properties when employed as the copolymers in prepregs for printed circuit wiring boards. For example, improved adhesion is achieved between the noncellulosic substrate and the polymers of components used in the wiring boards. These properties include, but are not limited to improved dielectric properties, improved adhesion to glass cloth substrates, etc.

Prepreg comprising saturated or unsaturated silane substituted cyclic

Copolymer for use in preparing prepregs, printed circuit wiring boards

Dielectric supports for electronic components, such as circuit boards, are provided which are comprised of two or more bulk polymerized norbornene-type monomers. The monomers may be easily processed into circuit boards, etc. by reaction injection molding. The copolymers obtained exhibit high heat distortion temperatures and good dielectric properties and a balance of properties that make them, for example, well suited for molded wire board materials.

Bulk polymerized cycloolefin circuit boards

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Sheffield Lake, OH, United States of America

David J Smith