Company Filing History:
Years Active: 1985-1992
Title: David J Reed: Innovator in Electronic Packaging
Introduction
David J Reed is a notable inventor based in Mesa, AZ (US), recognized for his contributions to electronic packaging technology. He holds a total of 5 patents, showcasing his innovative approach to enhancing electronic devices.
Latest Patents
One of his latest patents is titled "Electronic package having a non-oxide ceramic bonded to metal and method." This invention involves a non-oxide ceramic that is coated with silicon dioxide, utilizing a bonding glass with diboron trioxide to attach various components such as semiconductor chips and heatsinks. Another significant patent is "Glass bonding means and method," which describes an improved semiconductor die bonding structure. This method employs a ductile foil between the semiconductor die and the device package base, enhancing the reliability and performance of electrical devices.
Career Highlights
David J Reed has made significant strides in his career while working at Motorola Corporation. His work has focused on developing advanced materials and methods that improve the efficiency and durability of electronic packages.
Collaborations
Throughout his career, Reed has collaborated with notable colleagues, including James E Drye and Earl K Davis, contributing to the advancement of technology in the field of electronics.
Conclusion
David J Reed's innovative work in electronic packaging has made a lasting impact on the industry. His patents reflect a commitment to improving the functionality and reliability of electronic devices.
Inventor’s Patent Attorneys refers to legal professionals with specialized expertise in representing inventors throughout the patent process. These attorneys assist inventors in navigating the complexities of patent law, including filing patent applications, conducting patent searches, and protecting intellectual property rights. They play a crucial role in helping inventors secure patents for their innovative creations.