Prairie Grove, AR, United States of America

David J Dye

This inventor holds 1 USPTO granted patent. Top assignee: Other. Active years: 2000.

IDiyas Innovation Intelligence. (2026). Inventor Profile: David J Dye. Retrieved from https://idiyas.com/inventor/david-j-dye

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:

goldMedal1 out of 834,570 
Other
 patents

Years Active: 2000

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1 patent (USPTO):Explore Patents

Title: David J. Dye and His Vertical Circuit Board Soldering Apparatus

Introduction

David J. Dye is an inventor associated with Prairie Grove, Arkansas. His patent work includes a vertical circuit board soldering apparatus designed to solder printed circuit boards by immersing them in a molten solder bath.

Latest Patents

Dye’s listed patent, “Vertical Circuit Board Soldering Apparatus,” describes a mechanism that vertically dips circuit boards into molten solder and uses air knives to remove excess solder as the boards leave the bath. Its sliding chassis accommodates different board sizes through an adjustable member moved by a screw jack. A pneumatic clamp grips the board’s upper edge, while a holder supports its lower edge. The apparatus also includes features intended to shed molten solder, maintain alignment, and promote uniform soldering from front to back. Dye is credited with 1 patent.

Career Highlights

The available information identifies Dye’s invention and location but does not specify his employer or broader career history. The apparatus reflects a practical focus on adjustable board handling, alignment, and solder control in circuit-board manufacturing.

Collaborations

Dave O. Corey is identified as Dye’s coworker. The available information does not describe their specific roles or any joint patent work.

Conclusion

David J. Dye’s patented apparatus addresses key challenges in vertical circuit-board soldering through adjustable positioning, secure board support, and features for controlling solder distribution.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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