This inventor holds 1 USPTO granted patent. Top assignee: Hewlett-Packard Development Company, L.p.. Active years: 2008.
Company Filing History:
Years Active: 2008
Title: David Hacklernan: Innovator in Nanoscale Patterning for Catalysis and Fuel Cells
Introduction
David Hacklernan is a notable inventor based in Monmouth, Oregon, who has made significant contributions to the field of nanoscale patterning. He is affiliated with Hewlett-Packard Development Company, L.P., where he has focused on developing innovative methods for creating nanoscale patterns in polymer membranes.
Latest Patents
Hacklernan holds a patent for "Imprinting nanoscale patterns for catalysis and fuel cells." This patent describes a method and mold for creating nanoscale patterns in an ion-selective polymer membrane. The process involves imprinting a mold, which consists of a substrate and a molding layer with protruding features, onto the polymer membrane. This technique allows for the creation of recessed features in the membrane, which can be utilized in electrochemical devices or fuel cells. The imprinted membrane can be enhanced by adding a metal catalyst to serve as a catalytic electrode.
Career Highlights
Throughout his career, Hacklernan has demonstrated a commitment to advancing technology in the field of catalysis and fuel cells. His innovative approach to nanoscale patterning has the potential to improve the efficiency and effectiveness of electrochemical devices. With a patent portfolio that includes 1 patent, he continues to contribute to the scientific community.
Collaborations
Hacklernan has worked alongside talented colleagues, including Yoocham Jeon and Laurie S. Mittelstadt. Their collaborative efforts have furthered the research and development of advanced materials and technologies.
Conclusion
David Hacklernan's work in nanoscale patterning represents a significant advancement in the field of catalysis and fuel cells. His innovative methods and dedication to research continue to influence the development of new technologies.
