David H Lee

Title: David H Lee: Innovator in Multi-Chip Module Technology

Introduction

David H Lee is a prominent inventor based in Arlington, VA (US). He has made significant contributions to the field of electronics, particularly in the area of multi-chip module technology. With a total of 2 patents to his name, Lee continues to push the boundaries of innovation in his field.

Latest Patents

One of David H Lee's latest patents is a system and method for multi-chip module die extraction and replacement. This innovative system allows for the separation of chips in a stacked multi-chip module configuration. The first chip is affixed to a partitioned interposer unit using adhesion layers, while the interposer's planar partitions are bonded with solder bumps. These bumps provide high tensile strength but low resistance to horizontal shear force or torque. The second chip is similarly affixed, enabling the chips to be separated by shearing or twisting the interposer portions apart.

Career Highlights

David H Lee is currently employed at BAE Systems Information and Electronic Systems Integration Inc. His work focuses on developing advanced technologies that enhance the performance and reliability of electronic systems. Lee's expertise in multi-chip modules has positioned him as a key player in the industry.

Collaborations

Throughout his career, David H Lee has collaborated with notable colleagues, including John A Hughes and Thomas E Love. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

David H Lee is a distinguished inventor whose work in multi-chip module technology has made a lasting impact on the electronics industry. His innovative patents and collaborations with esteemed colleagues highlight his commitment to advancing technology.