David E Fisch

Title: Innovations of David E Fisch in 3D Memory Circuits

Introduction

David E Fisch is an accomplished inventor based in Corrales, NM (US). He has made significant contributions to the field of semiconductor technology, particularly in the development of three-dimensional (3D) memory circuits. His innovative approach has the potential to enhance data storage and processing capabilities in modern electronics.

Latest Patents

David E Fisch holds a patent for a 3D memory circuit. This invention provides a unique architecture where data lines of one or more memory circuits are placed on a different integrated circuit (IC) die than the memory blocks themselves. The design includes multiple IC dies stacked together, allowing for efficient data transfer through z-axis connections. These connections are notably short, measuring less than 10 or 20 microns, which enhances the performance of the memory circuit.

Career Highlights

David E Fisch is associated with Adeia Semiconductor Technologies LLC, where he continues to push the boundaries of semiconductor innovation. His work focuses on creating advanced memory solutions that can meet the growing demands of data-intensive applications. His expertise in 3D circuit design has positioned him as a key player in the semiconductor industry.

Collaborations

David collaborates with talented professionals in his field, including Javier A DeLaCruz. Together, they work on advancing semiconductor technologies and exploring new possibilities in memory circuit design.

Conclusion

David E Fisch's contributions to the field of 3D memory circuits exemplify the innovative spirit of modern inventors. His work not only enhances the efficiency of data storage but also paves the way for future advancements in semiconductor technology.