David E Boone

Title: David E Boone: Innovator in Electrical Bonding Technology

Introduction

David E Boone is a notable inventor based in Austin, TX (US). He has made significant contributions to the field of electrical bonding technology. His innovative approach has led to the development of a unique bonding method that enhances the efficiency of electrical connections.

Latest Patents

David E Boone holds 1 patent for his invention titled "Single Point Bonding Method and Apparatus." This patent describes a single point bonding apparatus and method for bonding one electrical conductor to a second electrical conductor. The process utilizes a thermosonic method that incorporates force, time, temperature, and ultrasonic energy as key parameters in forming the bonds. The bonding tool features a tip with multiple nonparallel surfaces that maximize the amount of ultrasonic energy coupled to the electrical conductors. These surfaces can either be recessed into the tip or protrude outwardly, allowing for the coupling of ultrasonic energy in both parallel and perpendicular directions to the conductors.

Career Highlights

David E Boone is associated with the Microelectronics and Computer Technology Corporation, where he has applied his expertise in electrical bonding technology. His work has been instrumental in advancing the capabilities of bonding methods used in various electronic applications.

Collaborations

Some of his notable coworkers include Gregory E Pitts and Daniel M Andrews. Their collaborative efforts have contributed to the innovative environment at the Microelectronics and Computer Technology Corporation.

Conclusion

David E Boone's contributions to electrical bonding technology exemplify the impact of innovation in the field. His patent for the single point bonding method showcases his commitment to enhancing electrical connections through advanced techniques.