David D Oliver

Title: David D Oliver: Innovator in Semiconductor Technology

Introduction

David D Oliver is a notable inventor based in Phoenix, AZ, who has made significant contributions to the field of semiconductor technology. With a total of 2 patents to his name, Oliver has developed innovative methods that enhance the efficiency and effectiveness of semiconductor processing.

Latest Patents

One of Oliver's latest patents is titled "Method of bonding a semiconductor wafer." This invention involves removing a portion of an active wafer at the edge after it has been bonded to a base wafer. This process prevents chipping of the edge during the thinning of the active wafer, ensuring a more reliable and durable product. Another significant patent is "Heating apparatus and method for semiconductor material slicing process." This invention provides a localized heating apparatus and method for breaking an adhesive joint between a mounting block and a semiconductor material ingot. The innovation allows for faster heating and cooling, thereby reducing the time required for the slicing process.

Career Highlights

David D Oliver is currently employed at Motorola Corporation, where he applies his expertise in semiconductor technology. His work has been instrumental in advancing the company's capabilities in this critical area of electronics.

Collaborations

Throughout his career, Oliver has collaborated with notable colleagues, including Frank T Secco d'Aragona and Raymond C Wells. These partnerships have contributed to the development of innovative solutions in the semiconductor industry.

Conclusion

David D Oliver's contributions to semiconductor technology through his patents and work at Motorola Corporation highlight his role as a key innovator in the field. His inventions continue to influence the efficiency of semiconductor processing, showcasing the importance of innovation in technology.