David Cure

Title: David Cure: Innovator in High-Speed Interconnect Systems

Introduction

David Cure is a notable inventor based in West Melbourne, FL (US). He has made significant contributions to the field of high-speed interconnect systems, holding 2 patents that showcase his innovative approach to technology.

Latest Patents

Cure's latest patents include "Systems and methods for providing a high speed interconnect system with reduced crosstalk" and "Systems and methods for providing a PWB." These patents detail methods that involve forming a Core Substrate (CS) with a First Via (FV) and disposing a First Trace (FT) on an exposed surface of CS that is in electrical contact with FV. The process continues with laminating a first HDI substrate to CS, ensuring that FT electrically connects FV via with a Second Via (SV) formed through the first HDI substrate. Additionally, a Second Trace (ST) is disposed on an exposed surface of the first HDI substrate, which is in electrical contact with SV. The innovation further includes laminating a second HDI substrate to the first HDI substrate, allowing ST to connect SV to a Third Via (TV) formed through the second HDI substrate. Notably, SV comprises a buried via with a central axis spatially offset from the central axes of FV and SV, while FV and SV have diameters smaller than that of TV.

Career Highlights

David Cure is currently employed at Eagle Technology, LLC, where he continues to develop and refine his innovative ideas. His work focuses on enhancing the efficiency and performance of interconnect systems, which are crucial in modern electronic devices.

Collaborations

Cure collaborates with talented individuals such as Michael T DeRoy and Marvin D Miller, contributing to a dynamic work environment that fosters innovation and creativity.

Conclusion

David Cure's contributions to high-speed interconnect systems reflect his dedication to advancing technology. His patents and collaborative efforts position him as a key figure in the field of innovation.