Company Filing History:
Years Active: 2012
Title: David Chevrie: Innovator in Integrated Packaging Technology
Introduction
David Chevrie is a notable inventor based in Bretteville sur Odon, France. He has made significant contributions to the field of integrated packaging technology. His innovative approach has led to the development of a unique device substrate that enhances the functionality and efficiency of semiconductor elements.
Latest Patents
David Chevrie holds a patent for an integrated package that features a device substrate with a major surface, a semiconductor element, and electrically conductive device connectors. This invention includes an interconnection substrate that defines a sealing recess surrounded by a sealing ring. The design allows for a sealed cavity that contains the semiconductor element, ensuring optimal performance and reliability. His patent is a testament to his expertise and creativity in the field.
Career Highlights
Throughout his career, David has demonstrated a commitment to innovation and excellence. He has worked diligently to advance technology in the semiconductor industry. His work at Ipdia has positioned him as a key player in the development of integrated packaging solutions.
Collaborations
David collaborates with talented professionals in his field, including Fabrice Verjus and Jean-Marc Yan-Nou. These partnerships have fostered a creative environment that encourages the exchange of ideas and the pursuit of groundbreaking technologies.
Conclusion
David Chevrie's contributions to integrated packaging technology reflect his dedication to innovation and excellence. His patent and collaborative efforts continue to influence the semiconductor industry positively.