David Bruce Burckel

Title: The Innovations of David Bruce Burckel

Introduction

David Bruce Burckel is a notable inventor based in Albuquerque, NM (US). He holds an impressive portfolio of 15 patents, showcasing his contributions to the field of technology and engineering. His work primarily focuses on advancements in integrated circuits and micromechanical systems.

Latest Patents

One of Burckel's latest patents is for a kinematic chip-to-chip bonding technology. This innovation involves integrating an integrated circuit (IC) with a waveguide and a v-groove array IC. The design maximizes optical coupling between an optical fiber and the waveguide, ensuring precise alignment and enhanced performance. Another significant patent involves the fabrication of multilayered carbon micromechanical systems (CMEMS). This technology allows for the production of carbon structures with high accuracy and repeatability, utilizing a process that includes lithography and pyrolysis.

Career Highlights

Throughout his career, Burckel has worked with prominent organizations such as Sandia Corporation and National Technology & Engineering Solutions of Sandia, LLC. His experience in these companies has contributed to his expertise in developing innovative technologies.

Collaborations

Burckel has collaborated with talented individuals in his field, including David R. Wheeler and Cody M. Washburn. These partnerships have likely fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

David Bruce Burckel's contributions to the field of technology through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry, paving the way for future innovations.