David A Miller

Title: Innovations of David A. Miller in Wafer Cushion Technology

Introduction

David A. Miller is an accomplished inventor based in Colorado Springs, CO. He has made significant contributions to the field of wafer cushion technology, holding two patents that showcase his innovative approach to improving cushioning systems for wafers.

Latest Patents

Miller's latest patents include advancements in single and dual stage wafer cushions. These innovations disclose a design that utilizes an edge hinge as a single first stage cushion and a second mid-span hinge for the dual stage wafer cushion. This dual stage design provides two distinctly different cushioning forces, contrasting with a single stage design where the force is linear with the amount of compression applied to the outer surfaces of the wafer cushion. The outer edge of the ring is designed for maximum expansion, ensuring that only the outer edge makes contact with the wafer's edge. The wafer cushion material flexes and absorbs shocks before they are transferred to the wafer stack. Additionally, it minimizes debris or contaminants from embedding into the cushion and prevents shearing of material from the cushion.

Career Highlights

David A. Miller is currently associated with Texchem Advanced Products Incorporated Sdn. Bhd., where he continues to develop innovative solutions in wafer technology. His work has significantly impacted the efficiency and reliability of wafer handling processes.

Collaborations

Miller collaborates with notable colleagues, including James D. Pylant and Christopher R. Mack, who contribute to the innovative environment at Texchem Advanced Products.

Conclusion

David A. Miller's contributions to wafer cushion technology reflect his dedication to innovation and improvement in the field. His patents demonstrate a commitment to enhancing the performance and reliability of wafer handling systems.