The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2017

Filed:

Feb. 16, 2011
Applicants:

James D Pylant, Temecula, CA (US);

Christopher R Mack, Broomfield, CO (US);

Alan L Waber, Wildomar, CA (US);

David a Miller, Colorado Springs, CO (US);

Inventors:

James D Pylant, Temecula, CA (US);

Christopher R Mack, Broomfield, CO (US);

Alan L Waber, Wildomar, CA (US);

David A Miller, Colorado Springs, CO (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B65D 85/00 (2006.01); H01L 21/673 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67369 (2013.01);
Abstract

Improvements in a single and dual stage wafer cushion is disclosed where the wafer cushion can use an edge hinge as a single first stage cushion and a second mid span hinge for the dual stage wafer cushion. This dual stage design gives two distinctly different cushioning forces as opposed to using a single stage design where the force is linear with the amount of compression that is being applied to the outer surfaces of the wafer cushion. The outside edge of the ring provides the greatest expansion such that only the outer edge of the ring makes contact with the outer edge of a wafer. The wafer cushion is a material that flexes and absorbs shocks before the shock is transferred to the wafer stack. The material minimizes debris or contaminants from embedding into the wafer cushion and also prevents sheading of material from the wafer cushion.


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