Bath, United Kingdom

David A Connell

This inventor holds 2 USPTO granted patents and 1 EPO patent. Top assignee: Eversafe Technologies Limited. Active years: 2018-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: David A Connell. Retrieved from https://idiyas.com/inventor/david-a-connell

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 2018-2019

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2 patents (USPTO):Explore Patents

Title: David A Connell: Innovator in Secure Portable Encasement Systems

Introduction

David A Connell is a notable inventor based in Bath, GB. He has made significant contributions to the field of secure portable encasement systems, holding a total of 2 patents. His innovative designs focus on enhancing security and functionality in portable encasements.

Latest Patents

Connell's latest patents include a secure portable encasement system. This system is designed to provide securement for a plurality of portable encasements, which can engage and disengage from a common docking unit. The design emphasizes the importance of secure interaction between the encasements and the docking units, ensuring safety and reliability.

Career Highlights

David A Connell is associated with Eversafe Technologies Limited, where he applies his expertise in developing advanced encasement solutions. His work has been instrumental in pushing the boundaries of innovation in this niche market.

Collaborations

Connell has collaborated with notable coworkers such as Hugh David Geoffrey McLean and Andrew J Redman. Their combined efforts contribute to the advancement of technology in secure encasement systems.

Conclusion

David A Connell stands out as an inventor dedicated to improving security in portable encasement systems. His innovative patents and collaborations reflect his commitment to advancing technology in this field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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