Company Filing History:
Years Active: 2012-2014
Title: Innovations by Darren Jay Walworth
Introduction
Darren Jay Walworth is a notable inventor based in Fullerton, CA. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on advanced packaging methods for semiconductor dies and integrated circuit packages.
Latest Patents
One of his latest patents is a "Chip-scale semiconductor die packaging method." This method involves packaging one or more semiconductor dies by providing a first die with a circuit surface and a connecting surface. It includes the use of a chip-scale frame with a well region, where the first die is coupled to a wall of the well region for electrical and mechanical coupling. The process also involves coupling a heat sink and attaching a lid to form an airtight chamber around the first die.
Another significant patent is the "Multi-layer high-speed integrated circuit ball grid array package and process." This patent describes high-speed ball grid array packages that include contact pads, conductive balls, and a signal via structure. The package design incorporates ground via structures and a ground interface plane, optimizing the performance of the integrated circuit.
Career Highlights
Darren currently works at Semtech Corporation, where he continues to innovate in the semiconductor industry. His expertise in packaging methods has contributed to advancements in high-speed integrated circuits.
Collaborations
Darren collaborates with Andrew Bonthron, a fellow innovator in the field. Their combined efforts enhance the development of cutting-edge technologies in semiconductor packaging.
Conclusion
Darren Jay Walworth's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in high-speed integrated circuits and semiconductor packaging methods.