The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2013
Filed:
Jan. 21, 2010
Darren Jay Walworth, Fullerton, CA (US);
Darren Jay Walworth, Fullerton, CA (US);
Semtech Corporation, Camarillo, CA (US);
Abstract
Examples of high-speed ball grid array packages and a process of forming a package are provided. A package may include contact pads disposed on a bottom surface, conductive balls, and a signal via structure. The package may also include a first ground via structure arranged along one or more first semi-circular contours around the signal via structure and extending vertically and a second ground via structure arranged along one or more second semi-circular contours around the signal via structure and extending vertically. The package may include a ground interface plane disposed in separation from the signal contact pad by a distance. The distance may be determined based on at least a size of the signal contact pad, a dielectric constant of a transition layer between the ground interface plane and the signal contact pad, and a distance between the signal via structure and the second ground via structure.