Company Filing History:
Years Active: 2004-2005
Title: Dario Filoteo: Innovator in PBGA Package Technology
Introduction
Dario Filoteo is a notable inventor based in Singapore, SG. He has made significant contributions to the field of packaging technology, particularly in the development of methods for enhancing the performance of PBGA (Plastic Ball Grid Array) packages. With a total of 2 patents to his name, Filoteo's work is recognized for its innovative approach to thermal management in electronic devices.
Latest Patents
Dario Filoteo's latest patents include a "Heat spreader anchoring and grounding method" and a "thermally enhanced PBGA package using the same." These patents provide a method and assembly for anchoring the heat spreader of a PBGA package to its substrate. The anchor features are strategically placed over the surface of the substrate, aligning with openings in the heat spreader stand-off. This design allows for quick and reliable positioning and anchoring of the heat spreader, enhancing the overall thermal performance of the package.
Career Highlights
Filoteo is currently employed at St Assembly Test Services Inc., where he continues to innovate in the field of electronic packaging. His work focuses on improving the efficiency and reliability of PBGA packages, which are critical components in modern electronic devices. His contributions have been instrumental in advancing the technology used in this area.
Collaborations
Dario Filoteo has collaborated with notable colleagues such as Il Kwon Shim and Hermes T Apale. These partnerships have fostered a creative environment that encourages the development of cutting-edge solutions in packaging technology.
Conclusion
Dario Filoteo's innovative work in PBGA package technology has made a significant impact on the industry. His patents reflect a commitment to enhancing thermal management solutions, which are essential for the performance of electronic devices. His contributions continue to shape the future of packaging technology.