Darbha Suryanarayana

Title: Darbha Suryanarayana: Innovator in Chip Carrier Technology

Introduction

Darbha Suryanarayana is a notable inventor based in Vestal, NY (US). He has made significant contributions to the field of technology, particularly in the development of innovative chip carrier systems. With a total of three patents to his name, Suryanarayana has demonstrated a commitment to advancing electronic packaging solutions.

Latest Patents

One of Suryanarayana's latest patents is for a "Chip carrier and cable assembly reinforced at edges." This invention involves reinforcement members that are strategically placed along the transverse edge regions of selected flexible cables within an integral chip carrier and cable assembly. These reinforcement members can be applied to all flexible cables and end areas or selectively to specific portions. They are made from a tough, tear-resistant polymer material, such as hot melt adhesive or polymer tape or film.

Another significant patent is for a "Method of fabricating a reworkable module." This invention describes a reworkable circuit package created through controlled collapse chip connection (C4) bonding of integrated circuit chips to circuit cards and boards. The encapsulant used in this process provides protection for the C4 connections while matching thermal expansion. Suryanarayana's innovation addresses the common issue of encapsulants interfering with reworkability by incorporating a passivating layer of Parylene, which is reworkable and can be uniformly deposited.

Career Highlights

Darbha Suryanarayana is currently employed at International Business Machines Corporation (IBM), where he continues to contribute to advancements in technology. His work has been instrumental in enhancing the reliability and performance of electronic components.

Collaborations

Throughout his career, Suryanarayana has collaborated with esteemed colleagues, including Herbert R Anderson, Jr and Constance J Araps. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Darbha Suryanarayana's contributions to the field of chip carrier technology exemplify his dedication to innovation. His patents reflect a deep understanding of the challenges in electronic packaging and a commitment to finding effective solutions. His work at IBM and collaborations with other professionals further highlight his impact on the industry.