International Business Machines Corporation

Darbha Suryanarayana

Donald Seton Farquhar

Krishna Gandhi Sachdev

David L Questad

Ho-Ming Tong

Harbans S Sachdev

Charles Robert Davis

Robert W Nufer

Kurt R Grebe

Stephen Joseph Fuerniss

Constance J Araps

Renuka S Divakaruni

Herbert R Anderson, Jr

Daniel P Kirby

Jeffrey Alan Zimmerman

Jack M McCreary

Stoyan M Zalar

Reinforcement members are disposed along only the transverse edge regions of selected flexible cables of an integral chip carrier and cable assembly, and along only the respectively aligned end areas of the chip carrier portion of the assembly. The reinforcement members may be disposed along all of the flexible cables and end areas of the assembly, or on only selected cable and end area portions of the assembly. The reinforcement members are formed of a tough tear resistant polymer material, such as a hot melt adhesive or polymer tape or film.

Chip carrier and cable assembly reinforced at edges

Disclosed is a reworkable circuit .package formed by controlled collapse chip connection ('C4') bonding of integrated circuit chips to circuit cards and boards, and direct chip attachment ('DCA') where an encapsulant is disposed under the chip. The encapsulant offers protection of the C4 connections and a thermal expansion matched to that of the C4 joints. However, most encapsulants interfere with reworkability. The disclosed circuit package overcomes this problem by the provision of a passivating layer of Parylene is reworkable, dry processable, uniformly depositable by vapor phase deposition, forming thin films on facing surfaces at the 3-5 micron film thickness corresponding to the C4 lift-off distance.

Method of fabricating a reworkable module

In a process for forming elements from a slurry that includes particulate ceramic and/or glass, an organic binder resin, and a solvent for the resin, where the element is shaped from the slurry, and the element heated to remove the organic materials of the slurry and subsequently fuse the ceramic and/or glass particles, the improvement comprised of coating the ceramic and/or glass particles prior to forming the slurry with a surface modification compound selected from the group consisting of organo silanes, organo silazanes, titanium chelates, titanium esters, and mixtures thereof.

Method of bonding inorganic particulate material

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Vestal, NY, United States of America

Darbha Suryanarayana