Danping Wang

Title: The Innovations of Danping Wang

Introduction

Danping Wang is a notable inventor based in Shanghai, China. He has made significant contributions to the field of micro-electronics, particularly through his innovative patents. His work focuses on developing advanced substrates and display devices that enhance the functionality and efficiency of electronic products.

Latest Patents

Danping Wang holds a patent for a prefabricated substrate, flexible substrate, flexible module, fabrication method, and display device. This invention includes a prefabricated substrate that consists of a first film layer as a rigid film layer and a second film layer as a flexible film layer. The second film layer wraps around the first film layer, providing a unique structure that enhances the performance of electronic displays. The design features a first surface and a second surface on the first film layer, with the second film layer comprising various portions that are strategically attached using adhesive layers.

Career Highlights

Danping Wang is associated with Shanghai Tianma Micro-electronics Co., Ltd., where he has been instrumental in driving innovation in display technology. His expertise in flexible substrates has positioned him as a key player in the industry, contributing to advancements that meet the growing demands for high-quality display solutions.

Collaborations

Danping Wang has collaborated with talented coworkers such as Zhen Liu and Qingsan Zhu. Their combined efforts have fostered a creative environment that encourages the development of cutting-edge technologies in micro-electronics.

Conclusion

Danping Wang's contributions to the field of micro-electronics through his innovative patents and collaborations highlight his role as a leading inventor. His work continues to influence the development of advanced display technologies, showcasing the importance of innovation in today's electronic landscape.