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Years Active: 2009
Title: Daniela Morin: Innovator in Microsystems Bonding Technology
Introduction
Daniela Morin is a prominent inventor based in Inveruno, Italy. She has made significant contributions to the field of microsystems integration, particularly through her innovative patent that addresses the bonding and electrical connection of distinct substrates.
Latest Patents
Morin holds a patent titled "Process for bonding and electrically connecting microsystems integrated in several distinct substrates." This process involves bonding two distinct substrates that integrate microsystems. The method includes forming micro-integrated devices in at least one of the substrates using micro-electronic processing techniques. The bonding is achieved by creating bonding regions of deformable material on a first substrate and pressing the substrates together to deform these regions, allowing them to react chemically with the second substrate. The bonding regions are typically formed from a thick layer of materials such as aluminum, copper, or nickel, topped with a thin layer of palladium or platinum. Spacing regions are also incorporated to ensure precise alignment between the two wafers. Morin's innovative approach has the potential to enhance the efficiency and reliability of microsystems.
Career Highlights
Throughout her career, Daniela Morin has worked with notable companies, including STMicroelectronics S.r.l. and Hewlett-Packard Company. Her experience in these leading technology firms has allowed her to refine her skills and contribute to advancements in microsystems technology.
Collaborations
Morin has collaborated with esteemed colleagues such as Ubaldo Mastromatteo and Mauro Bombonati. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Daniela Morin's contributions to the field of microsystems bonding technology exemplify her dedication to innovation. Her patent and career achievements highlight her role as a leading inventor in this specialized area.