The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2009
Filed:
Jun. 21, 2007
Ubaldo Mastromatteo, Bareggio, IT;
Mauro Bombonati, Abbiategrasso, IT;
Daniela Morin, Inveruno, IT;
Marta Mottura, Melegnano, IT;
Mauro Marchi, Bettolle, IT;
Ubaldo Mastromatteo, Bareggio, IT;
Mauro Bombonati, Abbiategrasso, IT;
Daniela Morin, Inveruno, IT;
Marta Mottura, Melegnano, IT;
Mauro Marchi, Bettolle, IT;
STMicroelectronics S.r.l., Agrate Brianza, IT;
Hewlett-Packard Company, Boise, ID (US);
Abstract
A process for bonding two distinct substrates that integrate microsystems, including the steps of forming micro-integrated devices in at least one of two substrates using micro-electronic processing techniques and bonding the substrates. Bonding is performed by forming on a first substrate bonding regions of deformable material and pressing the substrates one against another so as to deform the bonding regions and to cause them to react chemically with the second substrate. The bonding regions are preferably formed by a thick layer of a material chosen from among aluminum, copper and nickel, covered by a thin layer of a material chosen from between palladium and platinum. Spacing regions ensure exact spacing between the two wafers.