Mechernich, Germany

Daniel Wirtz

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: The Procter Gamble Company. Active years: 2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Daniel Wirtz. Retrieved from https://idiyas.com/inventor/daniel-wirtz-q0hj3zud

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2015

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1 patent (USPTO):Explore Patents

Title: The Innovations of Daniel Wirtz

Introduction

Daniel Wirtz is an accomplished inventor based in Mechernich, Germany. He has made significant contributions to the field of material handling through his innovative designs. His work primarily focuses on improving the efficiency of unwinding strands of material from wound packages.

Latest Patents

Wirtz holds a patent for a splicing apparatus designed for continuously unwinding strands of material. This invention enhances the process of material handling, making it more efficient and reliable. He has 1 patent to his name, showcasing his inventive capabilities.

Career Highlights

Daniel Wirtz is currently employed at The Procter & Gamble Company, where he applies his expertise in engineering and innovation. His role involves developing solutions that streamline production processes and improve product quality.

Collaborations

Throughout his career, Wirtz has collaborated with talented individuals such as Mario Castillo and Peter Nöthen. These partnerships have fostered a creative environment that encourages the development of groundbreaking ideas.

Conclusion

Daniel Wirtz exemplifies the spirit of innovation through his contributions to material handling technology. His patent for a splicing apparatus reflects his commitment to enhancing efficiency in industrial processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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