Scottsdale, AZ, United States of America

Daniel W Huff

This inventor holds 6 USPTO granted patents and 2 published patent applications, plus 1 CIPO patent and 2 EPO patents. Top assignee: The Boeing Company. Active years: 2022-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Daniel W Huff. Retrieved from https://idiyas.com/inventor/daniel-w-huff

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6 

% Patents Active = 100.0

 

 

Average Co-Inventor Count = 3.3

ph-index = 1

Forward Citations = 1(Granted Patents)


Location History:

  • Huntsville, AL (US) (2022 - 2023)
  • Scottsdale, AZ (US) (2022 - 2024)

Company Filing History:


Years Active: 2022-2024

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6 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Daniel W. Huff

Introduction

Daniel W. Huff is a notable inventor based in Scottsdale, AZ, who has made significant contributions to the field of materials science. With a total of six patents to his name, Huff's work focuses on enhancing the performance and durability of various materials, particularly in the aerospace industry.

Latest Patents

Huff's latest patents include innovative solutions such as a nonaqueous sol-gel for adhesion enhancement of water-sensitive materials. This patent describes sol-gels, sol-gel films, and substrates, including vehicle components, that utilize a sol-gel film. The sol-gel is created from a reaction involving an organosilane, a metal alkoxide, an acid stabilizer, and an organic solvent, maintaining a water content of about 10 wt % or less. Another significant patent is for organosiloxane-based surface treatments that enhance the adhesion and lubricity of metal surfaces. This composition improves lubricity while ensuring strong adhesion between the substrate surface and an overlying polymer coating, also providing corrosion resistance.

Career Highlights

Daniel W. Huff is currently employed at The Boeing Company, where he applies his expertise in materials science to develop innovative solutions for aerospace applications. His work has contributed to advancements in the performance and reliability of various components used in the industry.

Collaborations

Huff has collaborated with notable colleagues such as James A. Moore and Dennis K. Kennedy, further enhancing the innovative capabilities within his team.

Conclusion

Daniel W. Huff's contributions to the field of materials science through his patents and work at The Boeing Company highlight his role as a significant inventor. His innovative solutions continue to impact the aerospace industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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