Fremont, CA, United States of America

Daniel T O'Brien

This inventor holds 1 USPTO granted patent. Top assignee: Te Connectivity Solutions Gmbh. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Daniel T O'Brien. Retrieved from https://idiyas.com/inventor/daniel-t-o-brien

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: The Innovations of Daniel T O'Brien

Introduction

Daniel T O'Brien is an accomplished inventor based in Fremont, CA. He has made significant contributions to the field of sensor technology. His innovative work has led to the development of a unique sensor die that enhances pressure measurement capabilities.

Latest Patents

Daniel holds a patent for a "Sensor die with a diaphragm." This invention features a diaphragm that includes a first membrane and a second membrane positioned within the first membrane. The first membrane is designed to deflect in proportion to the differential pressure between its two sides. Simultaneously, the second membrane deflects in response to the absolute pressure on the first side of the diaphragm. This innovative design allows for more accurate pressure readings in various applications.

Career Highlights

Daniel T O'Brien is currently employed at Te Connectivity Solutions GmbH, where he continues to push the boundaries of sensor technology. His work at the company has been instrumental in developing advanced solutions for pressure sensing.

Collaborations

Daniel collaborates with Jeffrey C Fong, leveraging their combined expertise to drive innovation in their projects.

Conclusion

Daniel T O'Brien's contributions to sensor technology exemplify the spirit of innovation. His patent for the sensor die with a diaphragm showcases his ability to create solutions that address real-world challenges.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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