Orlando, FL, United States of America

Daniel Silva

This inventor holds 1 USPTO granted patent. Top assignee: Nscrypt, Inc.. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Daniel Silva. Retrieved from https://idiyas.com/inventor/daniel-silva

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: The Innovative Mind of Daniel Silva

Introduction

Daniel Silva is an accomplished inventor based in Orlando, FL. He has made significant contributions to the field of 3D fabrication. His innovative approach has led to the development of a unique apparatus that enhances the capabilities of 3D printing technology.

Latest Patents

Daniel Silva holds a patent for a "Method and apparatus for 3D fabrication." This invention includes a heat sink and a melt tube designed to melt filament or other materials as they are conveyed through the apparatus. The pen tip, which ejects the melted material, is securely held by a pen tip holder that features a heater element. This design improves the efficiency and effectiveness of 3D printing processes.

Career Highlights

Daniel Silva is currently employed at Nscrypt, Inc., where he continues to push the boundaries of 3D printing technology. His work has garnered attention for its innovative solutions and practical applications in various industries.

Collaborations

Daniel has collaborated with notable colleagues, including Michael W. Owens and Xudong Chen. Their combined expertise has contributed to advancements in the field of 3D fabrication.

Conclusion

Daniel Silva's contributions to 3D fabrication exemplify the spirit of innovation. His patent and work at Nscrypt, Inc. highlight his commitment to advancing technology in meaningful ways.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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