Daniel S Troiano

Title: The Innovations of Daniel S. Troiano

Introduction

Daniel S. Troiano is a notable inventor based in Cumberland, Rhode Island. He has made significant contributions to the field of integrated circuit technology. With a total of 3 patents to his name, Troiano's work has had a lasting impact on the industry.

Latest Patents

One of Troiano's latest patents is for an integrated circuit chip mold seal. This innovation introduces a gasket as a substitute for metal dambars during the encapsulation process of an integrated circuit chip package. The gasket can be designed as a straight strip for sealing one side of the lead frame or as a structure that matches the entire perimeter of the lead frame. It features grooves defined by projections between adjacent grooves. The depth of each groove is slightly greater than the thickness of the leads. When compressed before the injection of encapsulation material, the gasket material deforms, allowing the projections to fill the spaces between leads. The cross-sectional shape of each groove closely matches that of the respective lead within it.

Career Highlights

Troiano is currently employed at Texas Instruments Corporation, where he continues to innovate and develop new technologies. His work at this esteemed company has allowed him to collaborate with other talented professionals in the field.

Collaborations

One of his notable coworkers is Raymond A. Frechette, with whom he has likely shared insights and expertise in their projects.

Conclusion

Daniel S. Troiano's contributions to integrated circuit technology exemplify the spirit of innovation. His patents reflect a commitment to advancing the field and improving the processes involved in chip packaging. His work continues to influence the industry and inspire future inventors.