Santa Rosa, CA, United States of America

Daniel S Lam

This inventor holds 1 USPTO granted patent. Top assignee: Agilent Technologies, Inc.. Active years: 2006.


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2006

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1 patent (USPTO):Explore Patents

Title: The Innovations of Daniel S. Lam

Introduction

Daniel S. Lam is an accomplished inventor based in Santa Rosa, CA. He has made significant contributions to the field of radio frequency (RF) technology. His innovative work focuses on enhancing RF signal isolation in testing environments.

Latest Patents

Daniel S. Lam holds a patent for a "System and method for providing high RF signal isolation and low common ground inductance in an RF circuit testing environment." This invention achieves high port-to-port RF isolation for a test socket in a production RF test environment. It establishes a coaxial-type connection between the test socket and the device under test (DUT). This connection is achieved by partially surrounding each port of the DUT with a ground seal connected to the RF ground connection. In one embodiment, the ground seal is a metallic base plate of the test socket that surrounds the RF connection to the DUT. He has 1 patent to his name.

Career Highlights

Daniel S. Lam is currently employed at Agilent Technologies, Inc., where he continues to develop innovative solutions in RF technology. His work has been instrumental in advancing testing methodologies in the industry.

Collaborations

Some of his notable coworkers include David A. Feld and Paul D. Bradley. Their collaborative efforts contribute to the innovative environment at Agilent Technologies.

Conclusion

Daniel S. Lam's contributions to RF technology through his patent and work at Agilent Technologies highlight his role as a significant inventor in the field. His innovative approaches continue to influence the industry and improve testing environments.

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