This inventor holds 4 USPTO granted patents, plus 1 CIPO patent and 2 EPO patents. Top assignees: Inductev, Inc., Momentum Dynamics Corporation. Active years: 2017-2024.
Location History:
- Reading, PA (US) (2017 - 2019)
- Ephrata, PA (US) (2023)
Company Filing History:
Years Active: 2017-2024
Title: The Innovations of Daniel S Hackman
Introduction
Daniel S Hackman is an accomplished inventor based in Reading, PA (US). He holds a total of 4 patents that showcase his expertise in the field of wireless power transfer systems. His innovative approaches have contributed significantly to advancements in current sensing technologies.
Latest Patents
One of Hackman's latest patents focuses on a current sensing method that measures a fractional current through a coil with multiple windings. This method utilizes a current sensing resistor to gauge the current through a subset of the coil windings, while a voltage sensor measures the voltage drop across the resistor. The data collected is processed to determine both the fractional current and phase of the coil. The formula used for this calculation is I=n(V/Rx), where n represents the number of coil windings, V is the measured voltage, and Rx is the impedance of the current sensing resistor. This technology is particularly relevant for secondary windings in wireless power transfer systems.
Career Highlights
Throughout his career, Daniel S Hackman has worked with notable companies such as Inductev, Inc. and Momentum Dynamics Corporation. His contributions to these organizations have been instrumental in developing cutting-edge technologies in the field of wireless power.
Collaborations
Hackman has collaborated with several professionals in his field, including John M Wolgemuth and Andrew William Daga. These partnerships have fostered innovation and have led to the successful development of various projects.
Conclusion
Daniel S Hackman is a notable inventor whose work in current sensing methods has made a significant impact on wireless power transfer technologies. His patents and collaborations reflect his commitment to innovation and excellence in engineering.