Farsta, Sweden

Daniel Nilsson

This inventor holds 1 USPTO granted patent. Top assignee: Scint-X Ab. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Daniel Nilsson. Retrieved from https://idiyas.com/inventor/daniel-nilsson-9rw9pla8

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Daniel Nilsson: Micromechanical Structures and X-Ray Absorbing Materials

Introduction

Daniel Nilsson is an inventor based in Farsta, Sweden. His patent work includes a method for filling micromechanical structures with x-ray absorbing material. He is associated with Scint-X AB and has 1 patent listed in the information provided.

Latest Patents

Nilsson’s patent, “Filling Micromechanical Structures with X-Ray Absorbing Material,” describes a method and system for introducing the material into micromechanical structures. The process uses a wetting layer to help melted x-ray absorbing material flow across the surface of a structure containing the micromechanical features. Gas pressure is then applied to press the melted material into those structures.

Career Highlights

The patent highlights Nilsson’s work on a process that combines a wetting layer, heat, and gas pressure to fill micromechanical structures. This approach is intended to support the placement of x-ray absorbing material within small-scale structures.

Collaborations

Nilsson’s listed coworkers include Anna Sahlholm and Olof Svenonius. His company affiliation is Scint-X AB.

Conclusion

Daniel Nilsson’s patent describes a method for filling micromechanical structures with x-ray absorbing material, reflecting his contribution to innovation in this technical area.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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