Burlington, IA, United States of America

Daniel Morrow

This inventor holds 2 USPTO granted patents. Top assignee: Cnh America LLC. Active years: 2011-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Daniel Morrow. Retrieved from https://idiyas.com/inventor/daniel-morrow

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.4

ph-index = 2

Forward Citations = 44(Granted Patents)


Company Filing History:


Years Active: 2011-2013

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2 patents (USPTO):Explore Patents

Title: The Innovations of Daniel Morrow

Introduction

Daniel Morrow is an accomplished inventor based in Burlington, IA (US). He has made significant contributions to the field of engineering with his innovative designs and patents. With a total of 2 patents to his name, Morrow continues to push the boundaries of technology.

Latest Patents

Among his latest inventions are the Equipment Dipperstick and the Equipment Boom. These patents showcase his ability to create practical solutions for the industry, enhancing efficiency and functionality in equipment design.

Career Highlights

Morrow is currently employed at CNH America LLC, where he applies his expertise in developing cutting-edge agricultural and construction equipment. His work at CNH America LLC has positioned him as a key player in the innovation landscape.

Collaborations

Throughout his career, Morrow has collaborated with talented individuals such as Nathan John Bradley and Matthew Wagenbach. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of new technologies.

Conclusion

Daniel Morrow's contributions to innovation and invention are noteworthy, and his work continues to impact the industry positively. His dedication to improving equipment design through his patents exemplifies the spirit of innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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