Daniel M Oman

Title: Daniel M. Oman and Semiconductor Wafer Processing

Introduction

Daniel M. Oman is an inventor associated with Orlando, Florida, and Agere Systems Inc. His patent work addresses semiconductor manufacturing, particularly the removal of photoresist and polymer residues from wafers.

Latest Patents

The supplied information identifies one patent associated with Oman: “Methods of Downstream Microwave Photoresist Removal and Via Clean, Particularly Following Stop-On TiN Etching.” The invention describes removing photoresist from a semiconductor wafer using a relatively high-temperature, reactive-ion-etching-free microwave-generated plasma. The process detects the removal endpoint by monitoring changes in visible light from the chamber.

The patent also describes a multi-step approach that can first solubilize polymer on via walls, then remove photoresist, cool the wafer, check its temperature, and perform a plasma deglazing step. The patent presents specific gas mixtures and notes that some embodiments use fewer steps or combine steps. The supplied record lists 1 patent.

Career Highlights

Oman’s documented patent contribution focuses on plasma-based wafer cleaning and process control. By combining residue removal with optical endpoint detection, the disclosed method addresses cleaning needs in semiconductor fabrication, including processes following stop-on titanium nitride etching.

Collaborations

The supplied information names Timothy Scott Campbell and Paul B. Murphey as Oman’s coworkers. It does not specify their roles in the patent or establish whether they were co-inventors.

Conclusion

Daniel M. Oman’s listed patent describes a controlled microwave-plasma process for photoresist removal and via cleaning, reflecting a practical contribution to semiconductor manufacturing.