Daniel M Hutcheson

Title: The Innovative Contributions of Daniel M Hutcheson

Introduction

Daniel M Hutcheson is a notable inventor based in Bellbrook, Ohio. He has made significant contributions to the field of composite materials, holding a total of 3 patents. His work focuses on the development of advanced materials that enhance structural integrity and functionality.

Latest Patents

Hutcheson's latest patents include innovative designs for fiber reinforced composite cores and panels. The first patent describes a fiber reinforced core formed from plastics foam material, featuring elongated porous and fibrous webs and/or rovings. These rovings extend angularly through the webs, and the foam material is helically wound with layers of crossing rovings. This design allows for the infusion of hardenable adhesive resin into the core, enhancing its structural properties.

The second patent outlines a composite wall panel assembly and its method of production. This invention involves bonding outer and inner skins of wood sheet material to a core of rigid expanded foam. The design incorporates an integral continuous beam that supports substantial loads, making it ideal for applications above door or window openings. Additionally, the wall unit includes wood furring strips that provide channels for electrical wiring and strengthen the structure against wind deflection.

Career Highlights

Throughout his career, Hutcheson has worked with various companies, including Webcore Technologies, Inc. His experience in the industry has allowed him to refine his innovative ideas and contribute to advancements in composite materials.

Collaborations

Hutcheson has collaborated with notable professionals in his field, including Stephen W Day and G Scott Campbell. These collaborations have further enriched his work and expanded the impact of his inventions.

Conclusion

Daniel M Hutcheson is a distinguished inventor whose work in composite materials has led to significant advancements in the industry. His innovative patents reflect a commitment to enhancing structural integrity and functionality in various applications.