Hudson, WI, United States of America

Daniel M Czuprynski

USPTO Granted Patents = 1 

 

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: Innovator Spotlight: Daniel M. Czuprynski

Introduction: Daniel M. Czuprynski is an accomplished inventor based in Hudson, Wisconsin, who has made significant contributions to the field of optical materials. With a keen focus on enhancing optical films, Czuprynski holds a patent that showcases a novel approach to multilayer optical designs.

Latest Patents: Czuprynski’s notable patent includes a multilayer optical film layer, which is defined as comprising a blend of methyl methacrylate polymer and styrene acrylonitrile polymer. His innovation details an optical stack that includes at least one birefringent optical layer and at least one isotropic second optical layer boasting a birefringence of less than 0.04 at a wavelength of 633 nm. This advancement not only improves optical efficiency but also integrates a flexible skin layer or a combination, further enhancing the film's properties for various applications.

Career Highlights: Daniel M. Czuprynski is currently employed at 3M Innovative Properties Company, where he applies his expertise in developing cutting-edge optical materials. His work reflects a commitment to pushing the boundaries of technology in the optical film industry.

Collaborations: Throughout his career, Czuprynski has collaborated with esteemed colleagues such as Ta-Hua Yu and Timothy J. Hebrink. These partnerships have fostered a collaborative environment that facilitates innovation and the successful execution of groundbreaking projects.

Conclusion: Daniel M. Czuprynski exemplifies the spirit of innovation through his contributions to optical films at 3M Innovative Properties Company. His patent highlights the potential for improved optical materials, underscoring the importance of continuous research and collaboration in advancing technology.

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