Company Filing History:
Years Active: 1989-1990
Title: The Innovative Contributions of Daniel Lambert
Introduction
Daniel Lambert is a notable inventor based in Juvisy sur Orge, France. He has made significant contributions to the field of high-density integrated circuits, particularly in the area of multilayered metal networks. With a total of 2 patents to his name, Lambert's work has had a considerable impact on the technology industry.
Latest Patents
Lambert's latest patents include a method for forming a multilayered metal network for bonding components. This innovative approach involves creating a planarization layer over a multilayered metal interconnection network. The process includes chemically depositing a dielectric layer in the vapor phase, applying a viscous layer of spin-on-glass, and annealing it to form a compact mass. Additionally, he has developed a method for forming a planarization layer over a multilayered metal network that interconnects components of high-density integrated circuits. This method ensures that the spin-on-glass layer is uniformly etched to expose the upper surfaces of the conductors, enhancing the overall efficiency of the circuit.
Career Highlights
Daniel Lambert is currently associated with Bull S.A., a company known for its advancements in technology and computing solutions. His work at Bull S.A. has allowed him to explore innovative methods that improve the performance and reliability of integrated circuits.
Collaborations
Throughout his career, Lambert has collaborated with esteemed colleagues such as Pierre Merenda and Philippe Chantraine. These collaborations have fostered an environment of innovation and creativity, leading to the development of groundbreaking technologies.
Conclusion
Daniel Lambert's contributions to the field of integrated circuits exemplify the spirit of innovation. His patents and collaborative efforts continue to influence the technology landscape, showcasing the importance of research and development in advancing modern electronics.