Company Filing History:
Years Active: 2021
Title: The Innovative Contributions of Daniel Lai
Introduction
Daniel Lai is a notable inventor based in San Jose, California. He has made significant contributions to the field of substrate support structures, particularly in the context of plasma exposure. His work is characterized by a focus on enhancing the efficiency and effectiveness of clamping methods in semiconductor manufacturing.
Latest Patents
Daniel Lai holds a patent for "Methods for controlling clamping of insulator-type substrate on electrostatic-type substrate support structure." This innovative method involves positioning an insulator-type substrate on a support surface while applying an initial clamping voltage to rapidly accumulate electrical charge. The process includes monitoring a backside cooling gas leak rate and adjusting the clamping voltage to maintain optimal conditions. This patent reflects his commitment to advancing technology in substrate support systems.
Career Highlights
Lai is currently employed at Lam Research Corporation, a leading company in the semiconductor equipment industry. His role involves developing advanced technologies that improve manufacturing processes. His expertise and innovative mindset have made him a valuable asset to his team and the company.
Collaborations
Throughout his career, Daniel has collaborated with talented individuals such as Chin-Yi Liu and Rajitha Vemuri. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.
Conclusion
Daniel Lai's contributions to the field of semiconductor manufacturing through his innovative patent and work at Lam Research Corporation highlight his importance as an inventor. His dedication to improving technology continues to influence the industry positively.