Daniel Koehler

Title: The Innovations of Daniel Koehler

Introduction

Daniel Koehler is a prominent inventor based in Dresden, Germany. He has made significant contributions to the field of semiconductor technology. With a total of 2 patents, Koehler's work focuses on enhancing the efficiency and effectiveness of semiconductor structures.

Latest Patents

Koehler's latest patents include a method for filling trench and relief geometries in semiconductor structures. This method teaches how to fill trench structures formed in a semiconductor substrate. The trench structures are coated in a first deposition process with a first primary filling layer that exhibits high conformity and minimal roughness. Following this, a V etching process is performed to produce a V-profile down to a predetermined depth of the trench structure. Another notable patent is an etching process for recessing polysilicon in trench structures. This method involves applying a solution of NH4OH in water to the polysilicon region of a semiconductor device.

Career Highlights

Koehler is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His work at Infineon has allowed him to push the boundaries of semiconductor technology and contribute to advancements in the industry.

Collaborations

Throughout his career, Koehler has collaborated with notable colleagues such as Stephan Kudelka and Helmut Horst Tews. These collaborations have further enriched his work and contributed to the success of various projects.

Conclusion

Daniel Koehler's innovative contributions to semiconductor technology demonstrate his expertise and commitment to advancing the field. His patents reflect a deep understanding of the complexities involved in semiconductor structures, making him a valuable asset to Infineon Technologies AG and the broader technology community.