Singapore, Singapore

Daniel Knight

This inventor holds 1 USPTO granted patent. Top assignee: Vsl International Ag. Active years: 2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Daniel Knight. Retrieved from https://idiyas.com/inventor/daniel-knight

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: The Innovations of Daniel Knight

Introduction

Daniel Knight is an accomplished inventor based in Singapore, SG. He has made significant contributions to the field of thermal protection technology. With a focus on innovative solutions, Knight has developed a unique patent that addresses critical challenges in thermal insulation.

Latest Patents

One of Knight's notable inventions is the cylindrical thermal protection sheath. This invention is designed to cover a length of an elongated structural element. It features a sandwich-like composite insulation system that boasts a thermal conductivity of 0.11 W/m.°C at 800°C. The sheath has a thickness of less than 50 millimeters, making it an efficient solution for thermal protection.

Career Highlights

Daniel Knight is currently employed at VSL International AG, where he continues to work on innovative projects. His expertise in thermal protection systems has positioned him as a valuable asset to the company. Knight's dedication to advancing technology in this field is evident through his work and contributions.

Collaborations

Knight collaborates with talented professionals such as Thorsten Hauk and Mark Rebentrost. Their combined efforts enhance the development of innovative solutions in thermal protection technology.

Conclusion

Daniel Knight's contributions to the field of thermal protection through his innovative patent demonstrate his commitment to advancing technology. His work at VSL International AG and collaborations with skilled colleagues further highlight his impact in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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