Williamsville, NY, United States of America

Daniel Kester



Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: Inventor Spotlight: Daniel Kester and His Innovative Layered Structure

Introduction: Daniel Kester, an inventive mind hailing from Williamsville, NY, has made significant strides in the field of materials science. With a keen focus on layered structures, his work is paving the way for advancements in high shear and impact applications.

Latest Patents: Daniel holds a patent for a distinctive layered structure that enhances the performance of substrates in demanding conditions. This invention not only involves the construction of the layered structure itself but also includes a method to cover a substrate with this innovative layer. His patent represents a significant contribution to the development of materials that can withstand extreme circumstances.

Career Highlights: Currently, Daniel is affiliated with Sulzer Metaplas GmbH, a company renowned for its innovative solutions in the field of manufacturing and materials. His work continues to push boundaries, reinforcing the importance of continual innovation in today's competitive landscape. Throughout his career, Daniel has demonstrated a commitment to excellence and ingenuity, which has solidified his reputation as a prominent inventor.

Collaborations: Daniel collaborates closely with talented colleagues, including Chandra Venkatraman and Keith Majeroni. Together, they foster a collaborative environment that encourages creative problem-solving and the sharing of ideas, ultimately advancing their projects and company goals.

Conclusion: Daniel Kester's contributions to the field of layered structures highlight the importance of innovation in developing materials for specialized applications. His work not only enhances the capabilities of substrates but also exemplifies the spirit of collaboration and ingenuity that drives the industry forward. As inventors like Daniel continue to emerge, we can look forward to a future filled with groundbreaking advancements.

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