St. Louis, MO, United States of America

Daniel J Suda

This inventor holds 5 USPTO granted patents, plus 1 CIPO patent. Top assignee: Nidec Motor Corporation. Active years: 2021-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Daniel J Suda. Retrieved from https://idiyas.com/inventor/daniel-j-suda

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0


Average Co-Inventor Count = 2.3

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2021-2025

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5 patents (USPTO):Explore Patents

Title: The Innovations of Daniel J Suda

Introduction

Daniel J Suda is a notable inventor based in St. Louis, MO (US). He has made significant contributions to the field of engineering, particularly in the development of motor wire connector housings. With a total of 5 patents to his name, Suda has established himself as a key figure in his industry.

Latest Patents

One of his latest patents is the motor wire connector housing, which showcases his innovative approach to improving electrical connections in motors. This invention is a testament to his commitment to enhancing the functionality and reliability of motor components.

Career Highlights

Suda is currently employed at Nidec Motor Corporation, where he continues to push the boundaries of technology. His work at Nidec has allowed him to collaborate with other talented engineers and inventors, further enriching his experience and expertise.

Collaborations

Some of his notable coworkers include Michael W Major and Matthew D Allen. Their collaborative efforts contribute to the innovative environment at Nidec Motor Corporation.

Conclusion

Daniel J Suda's contributions to the field of engineering through his patents and work at Nidec Motor Corporation highlight his role as an influential inventor. His dedication to innovation continues to drive advancements in motor technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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