Daniel J Quinn

Title: The Innovations of Daniel J Quinn

Introduction

Daniel J Quinn is a notable inventor based in Carrollton, TX (US). He has made significant contributions to the field of integrated circuits, holding two patents that showcase his innovative spirit and technical expertise.

Latest Patents

Quinn's latest patents include an "Integrated-circuit leadframe adapted for a simultaneous bonding operation." This invention features a leadframe for an integrated circuit that includes a set of individual leads temporarily connected in an array. Each lead has an exterior portion shaped in a standard form and an interior portion designed to form a standard array of contacts, ensuring the same spring constant for deflections perpendicular to the plane of the leadframe. His second patent, "Automatic assembly of integrated circuits," describes a system for the assembly and packaging of integrated circuits. This system employs circuit dice with contact pads in a standard array, a leadframe with leads configured to have the same spring constant, and methods for removing selected dice from a wafer array under computer control, allowing for the simultaneous bonding of all leads to the die.

Career Highlights

Quinn has built a successful career at Thomson Components-Mostek Corporation, where he has been able to apply his innovative ideas in practical settings. His work has contributed to advancements in the efficiency and effectiveness of integrated circuit assembly.

Collaborations

Throughout his career, Quinn has collaborated with talented individuals such as Wayne A Mulholland and Robert Henry Bond. These partnerships have likely enriched his work and led to further innovations in the field.

Conclusion

Daniel J Quinn's contributions to the field of integrated circuits through his patents and career at Thomson Components-Mostek Corporation highlight his role as a significant inventor. His work continues to influence the industry and pave the way for future innovations.