Newbury, MA, United States of America

Daniel J Prezioso

This inventor holds 1 USPTO granted patent. Top assignee: Hewlett Packard Enterprise Development LP. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Daniel J Prezioso. Retrieved from https://idiyas.com/inventor/daniel-j-prezioso-urxj2rxx

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Daniel J. Prezioso: Patent Inventor in Circuit-Board Drilling

Introduction

Daniel J. Prezioso is an inventor associated with Newbury, Massachusetts. His patent work addresses precision drilling in circuit-board manufacturing. He is associated with Hewlett Packard Enterprise Development LP.

Latest Patents

The provided information identifies one patent associated with Prezioso: “Apparatus, System, and Method for Backdrilling Vias Based on Depth Measurements Taken During Primary Drilling Applications.” The invention describes a system that uses a conductive drill bit and circuitry to measure the depth of a ground layer during primary drilling. Based on that measurement, the system can calculate the depth of a nearby electrical layer and help prevent the drill from reaching it during backdrilling. The patent describes related apparatuses, systems, and methods for controlling drilling depth.

Career Highlights

Prezioso’s listed patent reflects work on improving accuracy and protecting circuit-board layers during via backdrilling. The disclosed approach uses measurements taken during primary drilling to inform subsequent drilling operations. His reported patent portfolio includes 1 patent.

Collaborations

The provided information associates Prezioso with Hewlett Packard Enterprise Development LP. No additional collaborators or specific project relationships were provided.

Conclusion

Daniel J. Prezioso’s patent focuses on using drilling-depth measurements to support more precise backdrilling and help protect electrical layers in circuit boards.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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