Location History:
- Erie, PA (US) (1990)
- Oceanside, CA (US) (2010 - 2012)
Company Filing History:
1 out of 15 
2 out of 832,891 Years Active: 1990-2012
Title: The Innovations of Daniel J Michaels
Introduction
Daniel J Michaels is an accomplished inventor based in Erie, PA (US). He holds a total of 3 patents that showcase his expertise in the field of electronic packaging. His innovative designs have contributed significantly to advancements in integrated circuit technology.
Latest Patents
One of his latest patents is the "Stacked ball grid array package module utilizing one or more interposer layers." This multilayer module comprises stacked integrated circuit (IC) package layers. A plurality of layers, preferably having ball grid array I/O, are stacked and interconnected using one or more interposer layers for the routing of electronic signals to appropriate locations in the module through angularly depending leads. The stack is further comprised of an interface PCB for the routing of electronic signals to and from the layers in the module and for connection to an external circuit.
Career Highlights
Throughout his career, Daniel has worked with various companies, including Aprolase Development Co., LLC. His contributions to the field have been recognized through his innovative patents and designs.
Collaborations
Daniel has collaborated with notable individuals in his field, including his coworker William E Boyd. Their partnership has likely fostered creativity and innovation in their projects.
Conclusion
Daniel J Michaels is a notable inventor whose work in electronic packaging has led to significant advancements in technology. His patents reflect his dedication to innovation and his impact on the industry.