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Aprolase Development Co., LLC

Daniel J Michaels

William E Boyd

A multilayer module comprised of stacked IC package layers is disclosed. A plurality of layers preferably having ball grid array I/O are stacked and interconnected using one or more interposer layers for the routing of electronic signals to appropriate locations in the module through angularly depending leads. The stack is further comprised of an interface PCB for the routing of electronics signals to and from the layers in the module and for connection to an external circuit.

Stacked ball grid array package module utilizing one or more interposer layers

A high energy rapid expansion bullet for handguns, rifles and the like with greater killing power and protection from excessive gas pressures due to overloading of powder or obstruction in the gun barrel and without over penetration which could endanger bystanders. A standard bullet (e.g., 45 caliber, 9 MM) is provided with a through bore (draft hole) from the tip to the base of the bullet. The inner end of the bore has a conical seat spaced from the central portion of a malleable disc seal surrounded by an annular seat for the rim of the disc. Gases generated by firing of the bullet deform the disc into contact with the conical seat and wedge the base of the bullet outward to seal the gases in the barrel of the gun and pull the rim of the disc inward to aid in separating the disc from the bullet as soon as the bullet leaves the barrel. Excessive gas pressure such as could come from overloading (too much powder), ruptures the disc and vents the gases to the atmosphere.

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Erie, PA, United States of America

Daniel J Michaels