This inventor holds 1 USPTO granted patent. Top assignee: Plessey Incorporated. Active years: 1981.
Company Filing History:
Years Active: 1981
Title: The Innovations of Daniel J Devlin
Introduction
Daniel J Devlin is a notable inventor based in Torrance, California. He has made significant contributions to the field of integrated circuit packaging. His work has led to advancements that enhance the efficiency and reliability of electronic devices.
Latest Patents
Devlin holds a patent for an integrated circuit package and lead frame. This invention is designed to meet JEDEC-11 standards and accommodates a nominal pin count ranging from 24 to 156. The patent emphasizes control measures and assembly procedures that ensure closer dimensional control and lead coplanarity. These features facilitate automatic die-attach and wire-bonding operations. The lead frame includes both diagonal and axial registration points, along with internal and external lead tie-bars. This design allows for precise attachment to a ceramic cover element, enhancing the overall functionality of the package.
Career Highlights
Devlin is associated with Plessey Incorporated, where he has contributed to various projects that focus on improving electronic packaging technologies. His expertise in integrated circuits has positioned him as a valuable asset in the industry.
Conclusion
Daniel J Devlin's innovations in integrated circuit packaging demonstrate his commitment to advancing technology in electronics. His patent reflects a deep understanding of the complexities involved in electronic assembly, paving the way for future developments in the field.