Company Filing History:
Years Active: 2011-2014
Title: The Innovations of Daniel Herrmann
Introduction
Daniel Herrmann is a notable inventor based in Tuebingen, Germany. He has made significant contributions to the field of sensor technology, holding a total of 3 patents. His work focuses on developing advanced sensor systems that enhance performance and reliability.
Latest Patents
Herrmann's latest patents include a sensor system and a method for operating a sensor system. This innovative sensor system features a first sensor-element block and a second sensor-element block, with at least one first sensor element and one second sensor element assigned to the first block, and at least one third sensor element assigned to the second block. The third sensor element is strategically positioned between the first and second sensor elements. Another notable patent is for a thermally decoupled micro-structured reference element for sensors. This reference element is designed to change its electrical property based on temperature and is arranged to be electrically insulated from the substrate while being thermally coupled to it. The design includes a circumferential cavern defined by the reference element and the substrate, which is bounded by a dielectric membrane.
Career Highlights
Daniel Herrmann is currently employed at Robert Bosch GmbH, a leading company in the field of technology and engineering. His work at Bosch has allowed him to push the boundaries of sensor technology and contribute to various innovative projects.
Collaborations
Throughout his career, Herrmann has collaborated with talented individuals such as Ando Feyh and Ingo Herrmann. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Daniel Herrmann's contributions to sensor technology through his patents and work at Robert Bosch GmbH highlight his role as an influential inventor in the field. His innovative designs continue to pave the way for advancements in sensor systems.
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